LINQSOL EMC-6043 | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- High Spiral flow
- Designed for SOT and Modules
- Low stress and Low Moisture Absorption
Product Description
LINQSOL EMC-6043 is a green epoxy molding compound developed for the encapsulation of power discrete semiconductor packages, including small outline transistors and modules. It offers high spiral flow to meet stringent moldability requirements. EMC-6043 seamlessly integrates advanced material properties, safety compliance, and superior performance, precisely meeting the requirements of discrete power semiconductor applications.
LINQSOL EMC-6043 is available in custom pellet dimensions. Contact us for more information.
Product Key Features:
- High spiral flow (140 cm) — improves moldability of molding compound, allowing EMC-6043 to fill intricate shapes better.
- Low Moisture Absorption (0.25%) — improves long-term reliability in humid environments.
- High glass transition temperature (Tg =140℃) — ensures that the molding compound remains in a rigid state at elevated temperatures, preventing substantial deformation and stress on the chip.
Applications:
- The coefficient of thermal expansion of LINQSOL EMC-6043 matches that of copper. It is compatible for encapsulation of copper wire coils.
- Also suitable for SOT, modules, and other power discrete semiconductor packages
CAPLINQ also offers other semiconductor mold-related products such as rubber cleaning sheets, melamine cleaning compounds, and wax conditioning sheets. For more information about EMCs, visit CAPLINQ Blog.
EMC-6043
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TDS_LINQSOL EMC-6043
- SDS_LINQSOL EMC-6043
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Physical Properties
Curing Conditions
Additional Information
Processing Instructions
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Before use, let LINQSOL EMC-6043 reach room temperature for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
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Use the materials within 72 hours after removing the container from cold storage.
Storage and Handling
- LINQSOL EMC-6043 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life at 5 °C is 183 days.
- Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.
