LINQSOL EMC-7535MF | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Green molding compound
- Designed for high-power TO packages
- High Tg, low water absorption, low modulus, and excellent thermal stability
Product Description
LINQSOL EMC-7535MF is a green epoxy molding compound specifically developed for high-voltage and high-power semiconductor devices. It offers low modulus to meet low-stress requirements. With a high glass transition temperature (Tg = 215 °C), minimal moisture absorption, a high comparative tracking index (CTI = 600 V), and a UL 94 V-0 flammability rating highlighting its adherence to stringent safety standards for high-power semiconductor applications, EMC-7535MF guarantees strong performance and outstanding reliability.
Overall, LINQSOL EMC-7535MF seamlessly integrates advanced material properties, safety compliance, and superior performance, precisely meeting the stringent demands of high-power semiconductor components such as TO packages. LINQSOL EMC-7535MF finds its niche in high-voltage and high-power discrete packages and power modules, including but not limited to IGBT, TO220, TO247, and other surface mount devices.
LINQSOL EMC-7535MF proved its reliability in customers' small SiC discretes—zero voids, zero delamination on Ni-plated Cu leadframes—even after thermal cycles (−40 °C ↔ +125 °C).
Key Features:
- High-temperature stability with high Tg (215 °C)
- Excellent electrical stability due to low ion content and mobility
- Low stress with low CTE (9 ppm) and low modulus (15GPa)
- Low moisture absorption and low mold shrinkage (0.22%)
- Halogen-free (does not contain Br, Sb, P)
- UL 94 V-0 Flammability
Application: SiC MOSFETs; TO-package Devices, IGBT Modules
EMC-7535MF
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- SDS_LINQSOL EMC-7535MF
- TDS_LINQSOL EMC-7535MF
Technical Specifications
General Properties
Electrical Properties
Chemical Properties
Thermal Properties
Mechanical Properties
Curing Conditions
Physical Properties
Additional Information
Processing Instructions
- Before use, let LINQSOL EMC-7535MF reach room temperature for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
- Use the materials within 72 hours after removing the container from cold storage.
Storage and Handling
LINQSOL EMC-7535MF is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life at 5 °C is 183 days.
