LINQSOL EMC-9012 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

LINQSOL EMC-9012 | Black Epoxy Mold CompoundLINQSOL EMC-9012 | Black Epoxy Mold Compound

Main features

  • Green epoxy molding compound
  • Designed for Ball Grid Array (BGA) and Land Grid Array (LGA) packages.
  • Ultra low water absorption, low stress, and excellent reliability performance.

Product Description

LINQSOL EMC-9012 is a green epoxy molding compound specifically developed for the encapsulation of Ball Grid Arrays (BGA) and Land Grid Array(LGA) packages. Its long spiral flow at 175 °C satisfies the moldability requirement for BGA and LGA molding. LINQSOL EMC-9012 series has low modulus that meets low-stress requirements. Additionally, with a UL 94 V-0 flammability rating and ultra low water absorption, EMC-9012 guarantees excellent performance and outstanding reliability.

LINQSOL EMC-9012 is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Overall, LINQSOL EMC-9012 series seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.

Product Family

EMC-9012

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

Packaging
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TDS, SDS & Technical Documents
  • SDS_LINQSOL EMC-9012
    English (Safety Data Sheet (SDS))
  • TDS_LINQSOL EMC-9012
    English (Technical Data Sheet (TDS))

Technical Specifications

General Properties
Color Color
Black
Filler Content Filler Content
89 %
Specific Gravity Specific Gravity
2.01
Chemical Properties
Moisture absorption Moisture absorption
0.12 %
Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
165 cm
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
133 °C
UL 94 Rating UL 94 Rating
V-0
Curing Conditions
Transfer Pressure Transfer Pressure
40-90 kg/cm2
Transfer Time Transfer Time
7-30 s

Additional Information

 

LINQSOL EMC-9012 Series Product Property Comparison

 
PROPERTY UNIT EMC-9012 EMC-9012H

Color

Black

Black

Filler content

%

89

87

Filler cut size

µm

55

53

Specific gravity

2.01

1.99

Spiral flow at 175 °C

cm

165

165

Ion content

Chloride (Cl) concentration

Sodium (Na+) concentration


ppm

ppm


7

6

7

4

Electrical conductivity of extract

µS⋅cm–1

31

30

Flexural strength

MPa

145

170

Flexural modulus

GPa

24

21.2

Adhesion Strength to Cu at RT

Before MSL3 Preconditioning 

After MSL3 Preconditioning


MPa

MPa


6.5

6.4

-

-

Glass transition temperature

°C

133

158

Coefficient of thermal expansion, α1

ppm/K

8

10

Coefficient of thermal expansion, α2

ppm/K

35

40

Gel time at 175 °C

sec

45

40

Flammability

UL-94

V-0

V-0

 

 

LINQSOL EMC-9012 Storage and Handling

LINQSOL EMC-9012 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 5 °C is 183 days.

Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.

 

Presentations

 

Ball Grid Array and Land Grid Array Packages

The presentation above shows the materials used  for Ball Grid Array and Land Grid Array Packages

Quad Flat No Lead and Dual Flat No Lead Packages

The presentation above shows the materials used for Quad Flat No Lead and Dual Flat No Lead Packages. 

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