LINQSOL EMC-9070 | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- MSL1 260°C
- Designed for QFN and DFN packages
- Moisture Corrosion Resistance
Product Description
LINQSOL EMC-9070 is a black semiconductor-grade epoxy molding compound designed for the encapsulation and protection of quad-flat no-leads (QFN) and dual-flat no-leads (DFN). Once molded and post-mold cured, this product provides optimum protection and reliability for these semiconductor devices.
LINQSOL EMC-9070 is a spherical silica filled (89%) EMC, typically used for QFN and DFN packages. QFN and DFN packages are low-profile packages that are MAP molded. This means that the packages are molded together in one large mold and then separated by cutting through the entire package. Epoxy molding compounds made for these types of packages must have a low warpage, and EMC-9070 is no exception. This product is formulated to have very low internal stress to reduce warpage, as well as low moisture absorption to increase MSL performance.
Key Features:
- JEDEC MSL 1 @260°C
- Low CTE (8ppm) and mold shrinkage (<0.2%)
- Low moisture absorption (0.33% after PCT 96hrs@121°C)
- Halogen-free (contains no br, Sb, P, etc.)
- REACH and RoHS compliant
- UL 94 V-0 Flammability
Application: QFN and DFN Packages
EMC-9070
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TDS, SDS & Technical Documents
- TDS_LINQSOL EMC-9070
Technical Specifications
General Properties
Thermal Properties
Mechanical Properties
Chemical Properties
Physical Properties
Additional Information
| PROPERTIES | UNITS | EMC-9070 | EMC-9070SF | EMC-9070P |
| Epoxy Type | - | Biphenyl | Biphenyl | Biphenyl |
| Hardener Type | - | Hydrophobic | Hydrophobic | Hydrophobic |
| Flame Retardant | - | Metal Hydroxide | Metal Hydroxide | Metal Hydroxide |
| Filler Content | % | 89 | 86 | 86.5 |
| Filler Sieved Size | um | 75 | 75 | 75 |
| Specific Gravity | - | 2.01 | 1.96 | 1.98 |
| Spiral Flow @175°C | inches | 50 | 79 | 54 |
| Gel Time @175°C | seconds | 35 | 40 | 24 |
| Glass Transition Temperature | °C | 126 | 126 | 126 |
| CTE by TMA, α1 | ppm/°C | 8 | 13 | 11 |
| CTE by TMA, α2 | ppm/°C | 30 | 45 | 39 |
| Hot Hardness, 120 sec@175°C | Shore D | 83 | 79 | 85 |
| Flexural Strength @25°C | MPa | 160 | 113 | 158 |
| Flexural Modulus @25°C | GPa | 26 | 21 | 23 |
| Moisture Absorption, PCT 96hrs@121°C | % | 0.33 | 0.40 | 0.40 |
| Mold Shrinkage | % | <0.2 | <0.3 | <0.3 |
|
Ionic Impurities (20hrs @160°C) pH Na+ Cl- |
- ppm ppm |
6.8 6.7 4.1 |
6.9 7.3 4.0 |
6.9 7.2 4.0 |
| Comments | General product for most QFN packages | Long spiral flow with good warpage control for large L/F and panel | Short gel time with good warpage control for productivity |
