LINQSOL EMC-G135 | Thermally Conductive Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Green epoxy molding compound
- Low cost thermally conductive molding compound
- Designed for rectifier bridges and SMX packages
Product Description
LINQSOL EMC-G135 is a green epoxy molding compound specifically developed for rectifier bridges (GBU, KBJ, GBS and etc.) and SMX packages. It offers good moldability and low modulus to meeting low-stress requirements. With a thermal conductivity of ~1.7W/m⋅K, it satisfies the heat dissipation required by high-performing packages. G135 boasts of its high-cost effectiveness and excellent workability with more than 500 continuous mold shots.
LINQSOL EMC-G135 guarantees strong performance and outstanding reliability. This product is deliberately formulated without the inclusion of substances prohibited by the European Union RoHS and REACH. Overall, LINQSOLTM EMC-G135 seamlessly integrates advanced material properties, safety compliance, and superior performance to deliver a reliable solution for semiconductor device encapsulation.
Key Features
- ~1.7 W/m·K thermal conductivity — Enhances heat spreading in high-current bridge rectifiers.
- Low modulus (~16 GPa) — Reduces package stress and risk of crack/warp during cycling.
- High moldability (spiral flow ~88 cm) — Fills complex cavities cleanly; supports small gates and long runners.
- 500+ continuous shots — Stable release and low bleed for fewer interruptions and lower scrap.
- Electrical cleanliness (Cl⁻ ~9 ppm, Na⁺ ~4 ppm) — Minimizes ionic pathways that can lead to leakage or corrosion.
- Low moisture uptake (~0.45% PCT 24 h) — Helps maintain insulation and dimensional stability.
- UL-94 V-0 flammability — Meets stringent safety requirements for power electronics.
- RoHS/REACH compliant — Free from substances of concern for global market access.
Reliability Tests Passed:
- HTRB, Tₐ=125°C, V=80%VR * 500 hour
- PCT, Tₐ=121°C, P=0.215atm, RH=100%* 98 hours
- Thermal Cycling Test, -55°C - +150°C * 500 cycles
Application/Suitable For:
- Bridge rectifier packages: GBU, KBJ, GBS; SMX packages
- AC/DC power supplies, chargers, UPS rectifier stages
- Motor drives and industrial controls (bridge diode modules)
- General power conversion, where thermal conductivity and low package stress are critical
EMC-G135
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TDS_LINQSOL EMC-G135
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Physical Properties
Curing Conditions
Additional Information
Processing Instructions
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Before use, let LINQSOL EMC-G135 reach room temperature for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
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Use the materials within 72 hours after removing the container from cold storage.
Storage and Handling
LINQSOL EMC-G135 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life at 5 °C is 183 days.
Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.
