LINQSOL EMC-G375 | Thermally Conductive Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Thermally conductive molding compound
- Designed for fullpack TO power packages and bridge rectifier packages
- Excellent mechanical integrity
Product Description
LINQSOL™ EMC-G375 is a high-performance, thermally conductive epoxy molding compound tailored for TO-3P, TO-220, TO-126, bridge rectifier, and other high-power semiconductor packages. With a thermal conductivity of up to 3.3 W/m·K, it effectively dissipates heat, ensuring device stability and extended service life. Its high filler loading (85%) provides superior mechanical integrity with minimal shrinkage and a flexural modulus of 25.5 GPa.
LINQSOL™ EMC-G375 also features a high glass transition temperature (175 °C) and excellent moisture resistance (≤0.2% absorption), guaranteeing long-term reliability in demanding environments. Fully compliant with RoHS and REACH, EMC-G375 offers a robust and environmentally responsible solution for next-generation power electronics.
Overall, LINQSOL™ EMC-G375 seamlessly integrates advanced material properties, safety compliance, and superior performance, precisely meeting the stringent demands of high-power semiconductor components such as TO packages..
Key Features:
- High Thermal Conductivity: Up to 3.3 W/m·K for efficient heat dissipation in power devices
- High Glass Transition Temperature: Tg of 175 °C ensures thermal stability under load
- Superior Mechanical Strength: Flexural modulus of 25.5 GPa minimizes warpage and maintains integrity
- Moisture Resistance: ≤0.2% absorption ensures reliability under humid and high-temperature conditions
- Environmental Compliance: Halogen-free, RoHS & REACH compliant for global acceptance
- Excellent Processability: Consistent spiral flow and low shrinkage for stable molding performance
Application:/ Suitable For:SiC MOSFETs; TO-package Devices, IGBT Modules
- TO-220, TO-3P, TO-126 full-pack power packages
- Bridge rectifier packages
- High-power discrete semiconductors
- Automotive and industrial power modules requiring high thermal management
- Devices in demanding environments requiring high Tg and mechanical strength
EMC-G375
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TDS_LINQSOL EMC-G375
- Krayden Line Card Apr 2026
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Chemical Properties
Physical Properties
Mechanical Properties
Curing Conditions
Additional Information
EMC-G375 Recommended Mold Parameters
| Parameters | Value | Unit |
| Preheating Temperature | 75-95 | °C |
| Molding Temperature | 170-190 | °C |
| Transfer Pressure | 40-100 | kgf/cm2 |
| Transfer Time | 10-35 | s |
| Cure Time | 120-270 | s |
| Post Mold Cure Time | 4-6 | h |
Processing Instructions
- Before use, let LINQSOL™ EMC-G375 reach room temperature (23 ±5 °C) for 24 hours. Keep the bag unopened and stored in a dry location with a relative humidity of ≤50% during thawing to prevent moisture contamination.
- Use the materials within 48 hours after removing the product from cold storage.
- When storing unused materials, vacuum seal the product in 2 layers of PE bags packaged in moisture barrier bag and store them in a < 10 °C environment. When using the materials again, use it within 48 hours after removing the product from cold storage.
LINQSOL™ EMC-G375 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment. The shelf life when stored below 10 °C is 183 days.
The technical information presented in this document is provided for reference only and does not constitute a guarantee of specific properties or performance. Actual results may vary depending on individual conditions and application methods. Users are strongly advised to perform their own testing and validation to determine suitability for their intended use and compliance with relevant regulations.
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