LOCTITE ECCOBOND EO7029
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Smartcard applications
- Non conductive
- Die attach & Encapsulant
Product Description
LOCTITE® ECCOBOND EO 7029 is a highly thixotropic, one component epoxy encapsulant with fast curing capability at moderate temperature and is designed specifically as non conductive die attach for smart card application and adjusted to be thixotropic to avoid flowing during cure. It's a great and cost effective 2 in 1 solution, similar to EO 7021.
Cure Schedule
- 5min @ 150°C. - Robust non-stress sensitive components
- 1hour @ 120°C. - Stress sensitive components
EO7029
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Product availability 
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TDS, SDS & Technical Documents
- LOCTITE ECCOBOND EO7029
- MSDS 464876 en_GB
Technical Specifications
General Properties
Specific Gravity Specific Gravity
1.20 Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
110 °C Physical Properties
Viscosity Viscosity
48,000 mPa.s 
