LOCTITE ECCOBOND FP4450HF
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Excellent corrosion resistance
- Low filler size
- Self levelling - Low alpha
Product Description
LOCTITE® ECCOBOND FP4450HF Fill encapsulant is designed for protection of bare semiconductor devices. Autoclave performance on live devices is greater than 1,000 hours with no failure, depending upon device and package type. The use of synthetic fused silica yields very low alpha particle emissions suitable for memory devices. A cavity or potting dam is required for flow control.
LOCTITE® ECCOBOND FP4450HF is a higher Tg version with a much lower filler cut size of 25um. It is admittedly a better product than FP4450, but much newer and therefore comes in lower package volumes and the price is slightly higher. Moisture uptake is expected to be comparable to FP4450. Its fine filler size, along with the lower viscosity make it indeed a "HF" High flow product.
Recommended Cure Schedule
- 30 minutes @ 125°C plus
- 90 minutes @ 165°C
FP4450HF
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TDS LOCTITE ECCOBOND FP 4450HF issue 02-19
- LOCTITE ECCOBOND FP4450HF known as HYSOL FP4450HF (1)
- LOCTITE ECCOBOND FP4450HF known as HYSOL FP4450HF 30CC FINE FILLER NL-MSDS_UT_NL
- LOCTITE ECCOBOND FP4450HF known as HYSOL FP4450HF 30CC FINE FILLER EN-MSDS_UT_EN
Technical Specifications
General Properties
Thermal Properties
Other Properties
Physical Properties
Additional Information
How does this product fare compared to the rest of the close FP family?
FP 4450HF resin system is closest to 4450 and we can consider 4450HF as smaller filler particle size version of 4450 (
We have internal information showing that these legacy semiconductor liquids pass UL94HB at 1/8” thickness but do not have the test data or yellow card nor are we going to test for it. This is anecdotal but, hopefully, helpful.
No available data for Dielectric strength. According to our scientists a highly silica filled encapsulant will have a range of 20 to 40Kv/mm.
