LOCTITE ECCOBOND FP4460
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Improved work life
- High temperature performance
- High flow
Product Description
LOCTITE® ECCOBOND FP4460 encapsulant is a silica filled, anhydride material designed for the protection of bare semiconductor devices. It is a low stress, low shrinkage and high flow oven cure product that is considered a glob top version of FP4450 with good ionic purity.
LOCTITE® ECCOBOND FP4460 has no JEDEC rating but its pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type.
Cure Schedule
- 3 hours @ 150°C
FP4460
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- LOCTITE ECCOBOND FP4460
- LOCTITE ECCOBOND FP4460
- LOCTITE ECCOBOND FP4460 known as HYSOL FP4460 10CC
- LOCTITE ECCOBOND FP4460 known as HYSOL FP4460 30CC
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
Additional Information
We have internal information showing that these legacy semiconductor liquids pass UL94HB at 1/8” thickness but do not have the test data or yellow card nor are we going to test for it. This is anecdotal but, hopefully, helpful.
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