LOCTITE ECCOBOND FP4526
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Low viscosity
- Excellent wettability
- Hi-Pb and Pb-free applications
Product Description
LOCTITE® ECCOBOND FP4526 epoxy underfill is designed for capillary flow on flip chip applications. It's fast flow and low viscosity along with its excellent wettability and adhesion make it ideal for high reliability applications.
LOCTITE® ECCOBOND FP4526 is a heat curable 63% filled underfill that can be used on ceramic, organic, solder mask and polyimide substrates and is typically used for Ceramic packages and FC on flex applications.
Cure Schedule
- 15 minutes @ 165°C(Heat sink or hot plate cure)
- 30 minutes @ 165°C (Convection oven)
FP4526
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TDS, SDS & Technical Documents
- LOCTITE ECCOBOND FP4526
- LOCTITE ECCOBOND FP4526
