LOCTITE ECCOBOND FP4545FC
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- High purity
- Rigid, low stress seal
- Good toughness
Product Description
LOCTITE ECCOBOND FP4545FC epoxy encapsulant designed as underfill and helps dissipate stress on solder joints and extends thermal cycling performance. This material is specially suited for flip-chip devices requiring improved crack/fracture resistance and noclean flux compatibility.
LOCTITE ECCOBOND FP4545FC is a one component, high purity underfill that forms a rigid, low-stress seal. It has good toughness and a filler weight of 55%.
Cure Schedule
- 60 minutes @ 165°C
- 120 minutes @ 170°C (enhanced performance)
FP4545FC
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 95 days
No longer available
No longer availablePackaging
TDS, SDS & Technical Documents
- ECCOBOND FP4545FC-EN
- 945398_MSDS_UT_US_EN
Technical Specifications
General Properties
Thermal Properties
Physical Properties
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