LOCTITE ECCOBOND FP4654
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- High purity
- Self levelling
- Low stress
Product Description
LOCTITE® ECCOBOND FP4654 is a low stress, Fill Encapsulant designed for larger cavity-fill or dam-and-fill applications. It is self levelling, jettable and provides an excellent thermal stability.
LOCTITE® ECCOBOND FP4654 has one of the lowest CTE α1 among the series (13ppm) and is our closest "mold compound" simulator with the highest (80%) Silica filler loading.
Recommended Cure Schedule
- 30 minutes @ 125°C plus
- 90 minutes @ 165°C
FP4654
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TDS, SDS & Technical Documents
- LOCTITE ECCOBOND FP4654
- LOCTITE ECCOBOND FP4654
Technical Specifications
General Properties
Pot Life Pot Life
72 hours Specific Gravity Specific Gravity
1.85 Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
146 °C Physical Properties
Viscosity Viscosity
32,000 mPa.s 
