LOCTITE ECCOBOND FP4802
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- High purity
- Excellent flow
- Phenolic encapsulant
Product Description
LOCTITE® ECCOBOND FP4802 is a high purity, liquid, phenolic encapsulant designed for use in applications utilizing lead-free solder. This low warpage product can withstand solder reflow temperatures up to 260°C after being exposed to JEDEC level 2 (85°C/60% RH, 168hours) preconditioning. It was formulated to meet “Green” non-halide objectives of many technical users and for temperature cycling ranges up to -65 to 150°C.
LOCTITE ECCOBOND FP4802 features excellent flow properties allowing the material to penetrate fine pitch wires and deep cavities without entrapping voids. A cavity or potting dam is required for flow control.
LOCTITE ECCOBOND FP4802 is suitable for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s), Plastic Ball Grid Arrays (PBGA’s), and full arrays on Low Temperature cofired Ceramic (LTCC).
Cure Schedule
- 60minutes @ 120°C plus 120minutes @ 165°C
- 30minutes @ 125°C plus 90minutes @ 165°C
Do not cure with a ramp rate >10°C/minute.
FP4802
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 50 days
Shipping in 12 weeks
Shipping in 65 daysPackaging
TDS, SDS & Technical Documents
- LOCTITE ECCOBOND FP4802
- LOCTITE ECCOBOND FP4802 US SDS
Technical Specifications
General Properties
Thermal Properties
Other Properties
Physical Properties
Additional Information
LOCTITE ECCOBOND FP4803 is now about to be introduced into the European market. The FP 4803 has been developed for high-volume automotive camera modules and passed all required tests. It claims all the features of 4802 plus a much lower CTE.
