LOCTITE ECCOBOND FP5201
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- High purity
- BMI/Acrylate
- One component
Product Description
LOCTITE ECCOBOND FP 5201 is designed for thermal compression bonding processes in flip chip to laminate assembly. It is a non conductive, high purity hybrid that provides excellent protection on electrical joints.
LOCTITE ECCOBOND FP 5201 is compatible with small assembly gap and tight pitches. A heat curable underfill that works well with solder, Gold and Cu pads on fine pitch laminate substrates.
Cure Schedule
- 30 minutes @ 165°C
Thermal Compression Bonder (TCB) Cure:
- 2, 3, and 4 seconds @ 240 to 280°C
FP5201
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TDS, SDS & Technical Documents
- LOCTITE ECCOBOND FP5201
- LOCTITE ECCOBOND FP 5201 SDS
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
Cure Speed of FP5201 at different temperatures
The DSC Cure Kinetics curve shows the cure speed of the FP5201 at temperatures from 120°C up to 240°C
