Hysol GR700-P2 | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

Hysol GR700-P2 | Black Epoxy Mold Compound

Main features

  • MAR Chemistry
  • Very low Tg: 115°C
  • Excellent electrical performance

Product Description

Hysol GR700-P2 is a black, silica filled (75um cut size) semiconductor grade epoxy molding compound. Its epoxy and hardener are based on MAR (Multi aromatic ring) chemistry and the product is part of our low Tg series of products with a Tg of 115°C. It's MSL 1 performance is good and some delamination issues are being dealt with to create an even superior version.

Hysol GR700-P2 can be used for High voltage applications and passes all electrical tests for Silicone Carbide SiC T0247 and T0252 packages with test voltages as high as 1700V. It delivers excellent performance and ease of use. It meets UL 94 V-0 flammability at 1/8 inch thickness. CTI has been measured to be 600V.

 

 

Product Family

GR700-P2

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Packaging
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TDS, SDS & Technical Documents
  • LDS_ GR700 version LMC20572-P2
    English (Technical Data Sheet (TDS))
  • 800082_GR 700 P2_CN_EN_1.0
    English (Safety Data Sheet (SDS))
  • GR510 GR700 GR710 GR920 Product Introduction
    English (Technical documents)
  • CAPLINQEpoxyMoldCompoundHandlingGuide1
    English (Technical documents)

Technical Specifications

General Properties
Color Color
Black
Density (g) Density (g)
1.99 g/cm3
Electrical Properties
Volume Resistivity Volume Resistivity
53000000000000000 Ohms⋅cm
Chemical Properties
Moisture absorption Moisture absorption
0.15 %
Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
89 cm
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
115 °C
Thermal Conductivity Thermal Conductivity
0.9 W/m.K
UL 94 Rating UL 94 Rating
V0

Additional Information

 

GR700 P2 1700 Voltage SiC TO247 Test

  • PKG TO247
  • LF: Cu/Ni

 

DMA and TMA curves for GR700-P2

 

 

 

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