Hysol GR730HT| Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Halogen free
- High adhesion
- High thermal conductivity
Product Description
Hysol GR730HT is a halogen free, black, silica filled (90% filler weight) semiconductor grade epoxy molding compound designed for Power Supply in Package (PSIP). This low stress, low moisture absorption product is a commercial success with many uses on TO applications.
Hysol GR730HT is a black, heat curable epoxy molding compound that can be used in semiconductor packages such as TO252. Furthermore, it meets UL 94 V-0 flammability at 1/8 inch thickness.
GR730HT
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Technical Specifications
General Properties
Color Color
Black Filler Content Filler Content
90 % Specific Gravity Specific Gravity
2.84 Electrical Properties
Volume Resistivity Volume Resistivity
8000000000000000 Ohms⋅cm Chemical Properties
Moisture absorption Moisture absorption
0.24 % Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
200 °C Thermal Conductivity Thermal Conductivity
3.2 W/m.K Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
76 cm Additional Information
| Property | GR730HT (86W9HT) | GR730HT (96G18) | XX-G1250S X5HT | XX-G3000HT |
| Filler content | 90 | 90 | 86 | 87 |
| Epoxy | Modified Multi functional type |
Hydrophobic EP | Modified Multi functional type |
Hydrophobic EP |
| Spiral Flow (inch) | 76 | 86 | 120 | 120 |
| Gel time (s) | 20 | 30 | 30 | 35 |
| Viscosity (PaS) | 12 | 10 | 15 | 8 |
| Specific Gravity | 2.84 | 2.67 | 2.93 | 2.85 |
| CTE 1 | 13 | 13 | 14 | 15 |
| CTE 2 | 50 | 40 | 48 | 50 |
| Tg (°C) | 200 | 122 | 215 | 130 |
| Flexural Strength/Modulus, Mpa | 104/ 23000 | 122/ 24000 | 143/ 29000 | 180/ 25000 |
| Mold Shrinkage (%) | 0.14 | 0.25 | 0.12 | 0.33 |
| Moisture Absorption PCT | 0.24 | 0.24 | 0.45 | 0.35 |
| Volume Resistance (@ 150) | NA | NA | 5E12 | 5E12 |
| Volume Resistance (@ RT) | 8E15 | 7E15 | NA | NA |
| Impurity CI- | 9 | 9 | 9 | 8 |
| Thermal conductivity (W/mK) | 3.2 | 3 | 2.9 | 3 |
