GR900 | QFN Epoxy Molding Compound
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Low stress and moisture absorption
- High adhesion
- Low moisture absorption
Product Description
Hysol GR900 is a green molding compound specifically developed for DFN/QFN MSL1 applications. It's designed to provide exceptional performance and reliability. The compound meets the UL94V-0 flammability standard at a thickness of 1/8 inch.
Product Key Features
- Halogen-free
- Low stress — Minimizes stress on delicate electronic components, enhancing long-term reliability.
- High adhesion — Provides a strong bond to the substrate, preventing delamination.
- Low moisture absorption — Reduces the risk of moisture-related defects.
- High reliability — Ideal for demanding applications where durability and performance are critical.
Applications
- DFN/QFNMSL1 Applications
GR900
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Catalog Product
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Product availability 
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TDS, SDS & Technical Documents
- GR900_GR900H_GR900C_SDS
Technical Specifications
General Properties
Filler Content Filler Content
89 % Filler Size Cut Filler Size Cut
53 µm Specific Gravity Specific Gravity
2.00 Electrical Properties
Volume Resistivity Volume Resistivity
45e15 Ohms⋅cm Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
50 cm Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
120 °C Thermal Conductivity Thermal Conductivity
0.9 W/m.K 
