Hysol GR910-K | Black Epoxy Mold Compound

Hysol GR910 K is a black epoxy molding compound specifically designed for Memory Ball Grid Arrays (BGA) and Land Grid Arrays (LGA). This semiconductor-grade material features spherical silica filler with a cut size of 53 µm, delivering exceptional fluidity and low shrinkage, which aids in advanced warpage control during manufacturing.

Hysol GR910 K is halogen-free and environmentally friendly, ensuring compliance with stringent safety standards. It offers excellent electrical performance, meeting the UL 94 V-0 flammability standard at a thickness of 1/8 inch.

Available Versions:

• GR910 K | Optimized for high Tg and low modulus applications
• GR910 K-31 | Tailored for high Tg and low shrinkage requirements

Key Features:

• High Thermal Stability | Glass transition temperatures of 155°C (GR910 K) and 153°C (GR910 K-31)
• Excellent Flowability | Ensures uniform coverage and filling during the molding process
• Low Mold Shrinkage | 0.22% for GR910 K and 0.19% for GR910 K-31, contributing to precise dimensions
• Low Coefficient of Thermal Expansion (CTE) | Minimizing stress during thermal cycling
• Low Water Absorption | Less than 0.35%, enhancing reliability in humid environments

Highly Recommended For:

• Advanced semiconductor packaging in high-performance applications
• Memory devices requiring robust mechanical and thermal properties
• Environmentally conscious projects where halogen-free materials are a must