HGPA12 | High Thermal Conductivity Gap Pad
Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
- 0.14 Thermal Impedance
- 12 Thermal Conductivity
- Low oil bleeding & Low volatile
Product Description
HGPA12
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TDS, SDS & Technical Documents
- HGPA12_TDS
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
Frequently Asked Questions About HGPA12 (12 W/m·K Thermal Gap Pad for Automation)
Learn More About HGPA12 (12 W/m·K Thermal Gap Pad)
HGPA12 is a high-conductivity silicone gap pad engineered for automated assembly and pressure-sensitive electronics. It provides excellent thermal transfer, stable mechanical integrity, and low contamination risk in sensitive environments.
Key Features at a Glance
- ✔ 12.0 W/m·K thermal conductivity
- ✔ Automation-friendly formulation
- ✔ Low residual stress
- ✔ Low siloxane and low volatility
- ✔ Wide -40°C to +125°C operating range
- ✔ UL 94 V-0 equivalent
Versatile Application Methods 🧰
Application Methods
HGPA12 supports manual or automated placement onto CPUs, GPUs, telecom modules, or lighting assemblies. Its mechanical robustness provides consistent compression in high-volume production.
Reliable Across Environments
Low volatile content, low oil bleed, and stable mechanical behavior make HGPA12 suitable for telecom, wireless, GPU, and lighting systems operating in harsh conditions.
Compliance You Can Trust ✅
HGPA12 meets key global standards for thermal interface safety and performance.
- UL 94 V-0 flame retardancy
- Low volatility per ASTM E595
- ASTM D5470 thermal validation
- ASTM D257 electrical insulation
- Low siloxane (D3–D10 <100 ppm)
- Wide operating temperature compliance (-40°C to +125°C)
Case 1: Improving Thermal Efficiency in High-Density 5G RF Amplifiers
5G telecom base stations rely on high-power RF power amplifier (PA) modules that generate significant heat densities. As module power output increases, maintaining thermal stability and preventing derating becomes a major design challenge which may results to thermal throttling.
Technical Issues:
- Hotspots of +18°C above average due to poor conformability
- Module derating occurred during extended high power operation
- Long-term reliability concerns (voiding, pump-out, bleed contamination)
High-power industrial LED fixtures such as those used in factories, warehouses, tunnels, and outdoor infrastructure operate continuously and generate significant heat at the LED junction. Excess heat leads to lumen depreciation, color shift, and premature failure, making efficient thermal management essential for maintaining long service life and consistent light output.
Technical Issues:
- LED junction temperatures exceeding design limits, causing early lumen drop-off
- Hotspot formation due to uneven metal-core PCB (MCPCB) surface contact
- Thermal grease dry-out over time leading to increased thermal resistance
- Long-term reliability concerns during 24/7 operation in hot or enclosed environments
Modern AI training and inference servers use multi-die GPU accelerators that generate extreme heat fluxes, especially during sustained workloads. Maintaining low thermal resistance across complex module topographies is essential to prevent performance throttling and maintain system uptime in data centers.
Technical Issues:
- High heat flux (exceeding 300 W/cm²) from stacked GPU dies
- Gap variation due to tolerances in heat spreaders and interposers
- Performance throttling during extended ML training workloads
- Long-term aging concerns with traditional pads at elevated temperatures
Advanced Driver Assistance Systems (ADAS) rely on high-power processors, radar modules, and sensor fusion units that operate continuously under harsh automotive temperature cycles. These compact modules generate high heat loads that must be controlled to prevent thermal throttling and loss of processing performance.
Technical Issues:
- Peak temperatures approaching thermal throttling threshold during continuous lane-assist operation
- Uneven PCB-to-housing gaps due to vibration and mechanical tolerances
- Traditional gap fillers showing micro-voiding after extended thermal cycling
- Risk of reduced processing speed and degraded ADAS reliability
How HGP12PA Helps in These Cases
Solstice HGP12PA provides a consistent thermal advantage across all the applications mentioned. Its high thermal conductivity of 12 W/m·K allows heat to move quickly away from critical components, helping to lower junction temperatures and prevent performance loss under heavy load. Overall, HGP12 supports reliable heat transfer, improves operational stability, and helps extend the lifetime of electronics that operate under high thermal stress.Recently viewed products
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