HW-HSTD | Heat Spreader - Transfer die stamping
Harmonization Code : 8473.30.80.00 | Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the machines of heading 8471 ; Other; Other
Main features
- Nickel plated / Au Spot
- Wide range form factor
- Complex designs - Higher volumes
Product Description
Honeywell HW-HSTD heat spreaders are used to dissipate heat from the chip. Heat spreaders can be produced in two different ways, by progressive stamping, and by transfer die stamping. Transfer Die stamped lids (heat spreaders) can be produced in a wide range of form factors. The maximum size of lids made with transfer die-stamping is 130 x 130mm. Heat spreaders are plated with Nickel (Ni) and can also be plated with Gold (Au) with selective spot plating on order to comply with the 24K /Mil spec.
Transfer die stamped heat spreaders are made with Transfer die stamping and enable complex part designs and allow high-volume - continuous processes, they are ideal for mass-scale, complex production. If you would require less volumes then it probably would make sense to invest in progressive stamped heat spreaders.
HW-HSTD
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Technical Specifications
No specifications available.
Additional Information
Transfer die-stamping - Heat spreader manufacturing process
Production capability of transfer die stamped heat spreaders
| Capability / Tolerances | HW-HSTD |
| Max Size (mm) | 130 X 130 |
| OD & ID (mm) | ±0.05 |
| Radii (mm) | >0.30 |
| Seal band with (mm) | ±0.040 |
| Thickness (mm) | 0.5-3.5 |
| Topside & Cavity flatness by part area (40mm2) in (mm) | 0.04 |
| Topside & Cavity flatness by part area (50mm2) in (mm) | 0.07 |
| Topside & Cavity flatness by part area (60mm2) in (mm) | 0.12 |
| Topside & Cavity flatness by part area (70mm2) in (mm) | 0.20 |
| Flange Width (mm) | ±0.10 |
| Cavity Depth (mm) | ±0.05 |
| Surface Profile (mm) | ±0.003 |
| Pedestal Depth (mm) | ±0.050 |
| Pedestal X,Y (mm) | ±0.050 |
