Hysol KL-3000FF | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Low CTE (18 ppm/°C)
- Low stress
- For GBU, KBU, SOP packages
Product Description
Hysol KL-3000FF is a black, semiconductor grade, high productivity molding compound, providing low stress and high reliability. It is 74% filled and achieves a flammability rating of V0 at UL94 testing conditions.
Hysol KL-3000FF is an environmentally friendly molding compound with high moldability that has a low coefficient of thermal expansion (18ppm/°C). It is typically used for SOD, KBU,GBU and DIP semiconductor packages.
KL-3000FF
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- Hyso Huawei TDS_KL-3000-FF_1041518_May-2021
