Hysol KL-G200S | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- MSL 1 260°C
- Low Cost of Ownership for Halogen free
- Designed for DO214 (SMA, SMB & SMX) packages
Product Description
Hysol KL-G200S is a black, halogen-free, semiconductor grade epoxy molding compound. It provides the lowest cost of ownership for a "non-halogen containing" epoxy molding compound. It works on surface mounted diodes such as D0214 in various sizes (SMA, SMB, SMC) and other low end discrete semiconductor and sensor packages.
Hysol KL-G200S passes MSL1 260°C. It is an epoxy molding compound that contains no bromine, antimony or phosphorus flame retardant. This product is designed to achieve JEDEC Level 1 requirements, at 260°C reflow temperature and provides the lowest cost of ownership with superior moldability and reliability. To top this up, it meets UL 94 V-0 Flammability at 6.35mm thickness.
KL-G200S Black
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 12 weeks
Shipping in 12 weeks
Shipping in 12 weeksPackaging
TDS, SDS & Technical Documents
- Hysol kL G200S SDS
- RoHS Hysol KL-G200S
- TDS KL-G 200S
- CAPLINQEpoxyMoldCompoundHandlingGuide1
Technical Specifications
General Properties
Chemical Properties
Physical Properties
Thermal Properties
Electrical Properties
Mechanical Properties
Curing Conditions
Recently viewed products
PET2S-Green | 2-mil Green Polyester Tape (PET) with Silicone Adhesive
- 2 mil green polyester film
- Silicone adhesive
- 7000V breakdown voltage
PET1S-Blue-DCD | 1-mil Blue Die Cut Polyester (PET) Tape with Silicone Adhesive | Single-Sided Discs
- 1 mil die cut polyester film
- Silicone adhesive
- 4200V breakdown voltage
