Hysol KL1000-3A | Black Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

KL1000-3A Cheap Black Epoxy Mold Compound Mini PelletsHysol KL1000-3A | Black Epoxy Mold CompoundKL1000-3A Black Epoxy Mold Compound

Main features

  • Lowest Cost of Ownership
  • Excellent Moldability
  • Designed for ZIP, SIL, DIP packages

Product Description

Hysol KL1000-3A is a black, semiconductor grade epoxy molding compound. It provides the lowest cost of ownership for an epoxy molding compound. It works on easy, low-end discrete semiconductor packages for companies that still use halogen-containing epoxy molding compounds.

Hysol KL1000-3A has a history that predates the acquisition of Huawei Electronics by Henkel. In 2005, Henkel formed a joint-venture with HuaweI Electronics in China to create Henkel Huawei Electronics (HHE) in Lianyungang China. HHE made low-end, halogen containing epoxy molding compounds that used Bromine or Antimony as a flame retardant. The KL1000-3A is an old product that is still made at Hysol Huawei today.

Hysol KL1000-3A is a halogen containing, legacy product that has been used for decades with great success for bridge rectifiers, PDIP and low end packages such as Zig zag In line (ZIP), Single In Line (SIL), Dual In line (DIP) and other low end semiconductor discrete Packages.

Product Family

KL1000-3A

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TDS, SDS & Technical Documents
  • Hysol KL1000-3A
    English (Technical Data Sheet (TDS))
  • SDS Hysol_KL 1000-3A_EU_EN_2023
    English (Safety Data Sheet (SDS))
  • Alt version - Hysol Huawei TDS_KL1000-3LX_December-2017
    English (Technical documents)
  • Alt version - 1688624_KL 1000-3LX_CN_EN_2.0
    English (Technical documents)
  • CAPLINQEpoxyMoldCompoundHandlingGuide1
    English (Technical documents)

Technical Specifications

General Properties
Color Color
Black
Filler Content Filler Content
75 %
Specific Gravity Specific Gravity
2.0
Chemical Properties
Moisture absorption Moisture absorption
0.20 %
Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
80 cm
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
165 °C
Thermal Conductivity Thermal Conductivity
1.3 W/m.K
UL 94 Rating UL 94 Rating
V0
Electrical Properties
Volume Resistivity Volume Resistivity
35000000000000000 Ohms⋅cm
Curing Conditions
Transfer Pressure Transfer Pressure
40 - 100 kg/cm2
Transfer Time Transfer Time
10 - 18 s

Additional Information

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Short Description of {product_name}

Typical applications and uses of {product_name} include:

  • ZIP packages
  • SIL packages
  • DIP packages
  • Other low-end discrete components

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