Hysol KL1000-3A | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other


Main features
- Lowest Cost of Ownership
- Excellent Moldability
- Designed for ZIP, SIL, DIP packages
Product Description
Hysol KL1000-3A is a black, semiconductor grade epoxy molding compound. It provides the lowest cost of ownership for an epoxy molding compound. It works on easy, low-end discrete semiconductor packages for companies that still use halogen-containing epoxy molding compounds.
Hysol KL1000-3A has a history that predates the acquisition of Huawei Electronics by Henkel. In 2005, Henkel formed a joint-venture with HuaweI Electronics in China to create Henkel Huawei Electronics (HHE) in Lianyungang China. HHE made low-end, halogen containing epoxy molding compounds that used Bromine or Antimony as a flame retardant. The KL1000-3A is an old product that is still made at Hysol Huawei today.
Hysol KL1000-3A is a halogen containing, legacy product that has been used for decades with great success for bridge rectifiers, PDIP and low end packages such as Zig zag In line (ZIP), Single In Line (SIL), Dual In line (DIP) and other low end semiconductor discrete Packages.
Packaging
TDS, SDS & Technical Documents
- Hysol KL1000-3A
- SDS Hysol_KL 1000-3A_EU_EN_2023
- Alt version - Hysol Huawei TDS_KL1000-3LX_December-2017
- Alt version - 1688624_KL 1000-3LX_CN_EN_2.0
- CAPLINQEpoxyMoldCompoundHandlingGuide1
Technical Specifications
General Properties
Chemical Properties
Physical Properties
Thermal Properties
Electrical Properties
Curing Conditions
Additional Information
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