LOCTITE ECCOBOND ME995-1-4
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- One component
- Thermally conductive
- High viscosity
Product Description
LOCTITE ABLESTIK ME 995-1-4 is a thermally conductive, glob top epoxy for microelectronics applications. It offers high viscosity and medium thixotropy and is typically used as a non conductive adhesive.
Cure Schedule
- 60 minutes @ 150°C or
40 minutes @ 170°C or
20 minutes @ 190°C
ME995-1-4
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Product availability 
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TDS, SDS & Technical Documents
- TDS LOCTITE ABLESTIK ME 995-1-4 issue 12-16 (1)
- MSDS LOCTITE ABLESTIK ME 995-1-4 issue 05-15 (EN) (1)
Technical Specifications
General Properties
Density (g) Density (g)
1.5 g/cm3 Pot Life Pot Life
72 hours Physical Properties
Viscosity Viscosity
335,000 mPa.s Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
110 °C Thermal Conductivity Thermal Conductivity
0.5 W/m.K 
