Hysol MG15F-0140 | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Anhydride cured
- Tg: 195°C
- For power discretes and high voltage rectifiers
Product Description
Hysol MG15F-0140 is a black, semiconductor grade, anhydride curing epoxy molding compound designed for high voltage power applications requiring good electrical stability at high temperature. A real classic. The work horse, as the industry would call it, product of the halogen and anhydride containing chemistries.
Hysol MG15F-0140 was typically used for power discretes and high voltage rectifiers. Despite its glorious history, the industry has been leaning towards next generation compounds that are future proof while still maintaining the same, or sometimes even better mold properties. GR 750 and the GR 750 XX series in general have nothing to envy and are good drop in candidates for the old guard.
MG15F-0140
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- Hysol Huawei TDS_MG 15F-0140_July-2017
- CAPLINQEpoxyMoldCompoundHandlingGuide1
Technical Specifications
General Properties
Chemical Properties
Physical Properties
Thermal Properties
Electrical Properties
Curing Conditions
Additional Information
Property Comparison Table of Hysol MG 15F-0140B vs Hysol MG15F-0140
| Property | Unit | MG 15F-0140B | MG15F-0140 |
|---|---|---|---|
| Gel time at 175°C | s | 18 | 17 |
| Spiral flow at 175°C | cm | 56 | 56 |
| Filler content | % | - | 69 |
| Shelf life at 5°C | days | 365 | 365 |
| Preheat temperature (conventional mold) | °C | 77 to 94 | 75 to 95 |
| Molding temperature | °C | 177 to 200 | 175 to 200 |
| Molding pressure | kgf/cm² | 42 to 84 | 42 to 84 |
| Transfer time | s | 6 to 15 | 6 to 15 |
| Curing time (3 mm) at 177°C | s | 60 to 75 | 60 to 75 |
| Curing time (3 mm) at 190°C | s | 45 to 60 | 45 to 60 |
| Post cure time at 175°C | h | 8 to 12 | 8 to 12 |
| Post cure time at 190°C | h | 2 to 4 | 2 to 6 |
| Glass transition temperature (Tg) | °C | 185 | 195 |
| CTE (alpha 1) below Tg | ppm/°C | 22 | 21 |
| CTE (alpha 2) above Tg | ppm/°C | 57 | 70 |
| Specific gravity | - | 1.81 | 1.81 |
| Molded shrinkage | % | 0.34 | 0.2 |
| Flexural strength | MPa | 115 | 127.5 |
| Flexural modulus | GPa | 10.3 | 13.7 |
| Thermal conductivity | W/m-K | - | 0.65 |
| Moisture absorption at 85°C/85% RH, 168 h | % | - | 0.5 |
| Volume resistivity at 500 V @ 21°C | ohm-cm | 4.3 × 1016 | 3.0 × 1016 |
| Extractable ionic content: Chloride (Cl-) | ppm | 9.9 | - |
| Extractable ionic content: Sodium (Na+) | ppm | 5 | - |
| Water extract conductivity | micromhos | - | 3 |
| pH of extract | - | - | 5.4 |
| Flammability rating at 3 mm | UL-94 | V-0 | V-0 |
Notes: Values are typical and should be confirmed against the latest product TDS and your process conditions. "-" indicates not yet available
This table summarizes and compares typical processing and cured-performance properties for two anhydride-cured epoxy molding compounds used in high-voltage power applications, showing that the molding window and cure conditions are broadly similar (gel time, spiral flow, transfer time, and cure schedules), while key material differences appear in thermo-mechanical and moisture-related behavior: MG15F-0140B reports lower Tg (195°C vs 185°C), lower CTE above Tg (70 vs 57 ppm/°C), lower flexural modulus (13.7 vs 10.3 GPa), but higher molded shrinkage (0.2% vs 0.34%), while both grades meet UL-94 V-0 at 3 mm and show high volume resistivity at 500 V and 21°C.
