Hysol MG27F-0521LF | Gold Epoxy Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

MG27F-0521LF Gold Epoxy Mold CompoundHysol MG27F-0521LF | Gold Epoxy Mold Compound

Main features

  • UL listed file number E255557
  • Long Flow version of MG27F-0521
  • Used for ceramic capacitors

Product Description

Hysol MG27F-0521 LF is a specially formulated Gold, laser markable product designed for use in high volume molding of multi-layer ceramic capacitors (MLCC). MG27F-0521 LF was developed to provide optimum moldability in conventional transfer molding applications. It features good moisture resistance and low ionics. Its gold color provides excellent contrast in lasermark applications.

Hysol MG27F-0521 LF  is listed under the UL file number E255557. It is a UL listed product for Multi Layer Ceramic Capacitors (MLCC). The entire list of UL-listed products can be found at the Hysol UL-listed Epoxy Molding compounds

Hysol MG27F-0521LF is designed for the following semiconductor packages:

  • Multi-Layer Ceramic Capacitors
  • Cermaic Resistors
  • Other passive electronics components
Product Family

MG27F-0521LF

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Packaging
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TDS, SDS & Technical Documents
  • MG27F-0521LF TDS (EN) Sep 2018
    English (Technical Data Sheet (TDS))
  • HYSOL MG 27F-0521LF EU SDS_EN_1.0 (1048213)
    English (Safety Data Sheet (SDS))
  • CAPLINQEpoxyMoldCompoundHandlingGuide1
    English (Technical documents)

Technical Specifications

General Properties
Color Color
Gold
Specific Gravity Specific Gravity
1.91
Electrical Properties
Volume Resistivity Volume Resistivity
89000000000000000 Ohms⋅cm
Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
63 cm
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
167 °C
Thermal Conductivity Thermal Conductivity
0.65 W/m.K
UL 94 Rating UL 94 Rating
V0
Mechanical Properties
Molded Shrinkage Molded Shrinkage
0.4 %
Curing Conditions
Transfer Pressure Transfer Pressure
35 - 105 kg/cm2
Transfer Time Transfer Time
12 - 25 s

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