Hysol MG40FS | Black Epoxy Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Designed for PDIP packages
- Excellent HTRB performance
- Ideal for high voltage discrete semiconductors
Product Description
Hysol MG40FS is a high productivity molding compound designed specifically for high volume encapsulation of PDIP, SOIC, Power discrete and High Voltage devices. This material is applicable for devices having chip dimensions up to 150 mils square. It has been formulated to provide the best possible moldability and as wide molding latitude as possible
Hysol MG40FS has excellent high temperature electrical stability. This makes it ideal for PDIP, TO220, TO247 and high voltage discrete semiconductor packages that need to resist higher temperatures. This product is available in both conventional (MG40FS) and automold (MG40FS-AM) versions.
MG40FS
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- Hysol MG40FS
- Hysol MG40FS SDS
- CAPLINQEpoxyMoldCompoundHandlingGuide1
Technical Specifications
General Properties
Electrical Properties
Chemical Properties
Physical Properties
Thermal Properties
Mechanical Properties
Curing Conditions
Additional Information
This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials.
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