LOCTITE ABLESTIK NCF 234
Harmonization Code : 3919.90.80.99 | Polyacrylic plates / sheets / film / tape / strip, self-adhesive, in rolls
Main features
- Non-conductive Underfill Film
- Enable fine pitch, narrow gap Cu Pillar
- Pb-free & low κ
Product Description
LOCTITE ABLESTIK NCF 234 transparent film is specially formulated for Pb free, low κ, thin gap, large and thin die used in advance flip chip applications. NCF 234 is suitable for die to die, die to wafer (TSV) or die to substrate applications.
NCF234
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TDS, SDS & Technical Documents
- LOCTITE_ABLESTIK_NCF_234_en_GL-3433564
Technical Specifications
General Properties
Film Thickness Film Thickness
34 µm Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
105 °C Additional Information
Thawing
- Allow container to reach room temperature before use, normally 30 minutes.
Recommended Cure Schedule
- 30 minutes ramp to 175ºC, hold 2 hours @ 175°C
