JNC PI-6322-001 | Insulating Polyimide Ink
Harmonization Code : 32159090 | Printing ink, writing or drawing ink, and other inks, whether or not concentrated or solid, specifically for those classified as other within that category


Main features
- Thermal Curable
- Heat Resistance
- Low Temperature Curing
Product Description
PI-6322-001 is a polyimide insulating ink designed to provide thermally curable solution to heat resistance and electrical insulation. It is engineered to provide electrical insulation with its advanced polyimide formulation ensures that your components remain safeguarded against electrical currents, allowing your devices to perform flawlessly even in high-voltage applications. Featured with only 1% water absorbance, this ink stands strong against moisture-induced vulnerabilities, guaranteeing consistent performance even in humid environments. Moreover, with a tensile modulus of 1500 MPa, this ink enhances mechanical stability, making it an excellent choice for applications requiring both electrical insulation and structural integrity.
Industry Applications:
Aerospace and Defense | Electronics Manufacturing | Industrial Sensors
Packaging
TDS, SDS & Technical Documents
- JNC PI-6322-001 TDS
- PI-6322-001_SDS
- Polyimide Ink - Inkjet printing instruction and tips 230614
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Mechanical Properties
Chemical Properties
Physical Properties
Additional Information
| Properties | PI-6322-001 |
| Solids content (wt. %) | 24 |
| Viscosity (mPa's) @25℃ | 11 |
| Surface tension (mN/m) @23℃ | 28 |
| Printing methods | Inkjet |
| Curing | 180℃ 120min |
| Post-curing | - |
| Volume resistivity (Ω*cm) | 1E+16 |
| Breakdown voltage (V/um) | 100 |
| Dielectric constant (1kHz) @1V | 3.8 |
| Tensile modulus (MPa) | 1500 |
| Elongation (%) | 6 |
| Residual stress (MPa) | 14 |
| 5% weight loss temp (℃) | 370 |
| CTE ( | 75 |
| Tg (℃) | 250 |
| Water absorbance (%) @23℃ | 1.0 |

