LOCTITE ABLESTIK QMI538NB
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- PTFE filled
- No bleed
- Lower modulus than QMI536NB
Product Description
LOCTITE ABLESTIK QMI538NB is a PTFE filled non-conductive die attach paste designed for applications which require very low stress and robust mechanical properties. This low modulus (100MPa) product is used for MEMS and die stacking, with NB standing for No Bleed.
LOCTITE ABLESTIK QMI538NB is a hydrophobic BMI Hybrid product that offers low viscosity and reduced resin bleed, along with stability at higher temperatures. With its excellent adhesive strength and good popcorning resistance after solder reflow temperatures it is typically used on solder resist, flexible tapes and on bare siliconE and die passivation.
Cure Schedule
- 30 minutes @ 175°C
- 60 minutes @ 150°C
QMI538NB
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- ABLESTIK QMI538NB-EN
- 807104_MSDS_UT_US_EN
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
QMI538NB is a lower modulus alternative of QMI536NB for MEMS and die stacking from the beginning.
