LOCTITE ABLESTIK QMI550
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Non conductive
- Hydrophobic
- Skip Cure
Product Description
LOCTITE ABLESTIK QMI550 non conductive die attach paste was designed to attach integrated circuits and components to advanced substrates. It is an off white, fluoropolymer filled, BMI hybrid that is stable at high temperatures.
LOCTITE ABLESTIK QMI550 has excellent interfacial adhesion strength and cohesive strength with great dielectric properties. It is designed for PBGA, CSP, array packages and die stacking substrates and works great with Solder masks, BT, FR, Polyimide, Au and other organic surfaces. Due to its higher modulus and soft PTFE filler, it can be used for small 1x1 die, specifically for small die stacking and sensor die attach.
Skip Cure
- ≥10 seconds @ 150°C
QMI550
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- LOCTITE ABLESTIK QMI 550
- LOCTITE ABLESTIK QMI 550 SDS
- LOCTITE ABLESTIK QMI550 known as HYSOL QMI550 (7g)
