LINQBOND SO-115CM | Moisture Curing Modified Silicone Adhesive
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- One-component
- Fast cure at low temperature
- High stability
Product Description
LINQBOND SO-115CM is a high-performance, moisture-curing modified silicone adhesives engineered for critical assembly applications requiring expedited processing and long-term bond integrity. SO-115CM has great adhesion to diverse substrates including plastics, metals, and glass, making it ideal for precision manufacturing environments.
Product Key Features:
- Accelerated Cure Kinetics: Exhibits significantly fast cure kinetics, directly contributing to increased throughput and reduced cycle times in high-volume manufacturing.
- Enhanced Adhesion Profile: Provides higher adhesion strength compared to conventional silicone-based adhesives.
- Sustainable & Low-VOC Formulation: Formulated with a sustainable, isocyanate-free resin system, improving occupational safety and a reduced environmental footprint. Its odor-free nature makes it suitable for enclosed or sensitive production areas.
Applications
- Component bonding in electronics
- General assembly of precision parts
SO-115CM
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Other Properties
Mechanical Properties
Physical Properties
Additional Information
Directions for Use
- Apply to a clean surface which should be free of dirt, grease or mold release. In many cases, a simple solvent wipe is sufficient.
- Pour or brush this product onto the substrates. It is not recommend to stir it onto the substrates to avoid formation of air bubbles. This product will be cured through air-drying but propeties depend on its thickness, curing temperatrue, and relative humidity.
- After bonding, do not move the substrate for one to two hours. It is expected to initially cure between 12-24 hours. If the layer is thick, the initial curing time will be longer.
- Use this product as soon as possible after opening the original package. When not in use, please replace the lid tightly and store in a cool and dry place.
- Cure time depends on part geometry, materials to be bonded, bondline thickness, and humidity. Cure schedule should be in accordance with actual specifications of production parts and equipment.
