LOCTITE ABLESTIK SSP 2020
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- High thermal conductivity
- High electrical conductivity
- High die shear strength
Product Description
LOCTITE® ABLESTIK SSP 2020 Silver sintering die attach adhesive is designed for devices requiring high thermal and electrical conductivity.It can reach around 200 W/mK when pressure is applied during sintering, making it one of the most thermally conductive die attach materials available. The only thing that can potentially go higher than that is pure silver at 400 W/mK. Please note that SSP stands for Silver Sintering and not semi sintering.
LOCTITE ABLESTIK SSP 2020 is formulated to provide high heat transfer generated from power devices and maintain high adhesion at operating temperatures as high as 260ºC. It is a solvent based silver sintering material that is typically not suitable for semiconductor die attach MSL requirements.
SSP2020
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TDS, SDS & Technical Documents
- LOCTITE ABLESTIK SSP 2020
- LOCTITE ABLESTIK SSP2020
- LOCTITE ABLESTIK SSP 2020
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
Additional Information
Pressureless Sintering Process
Ag or Au Leadframe sinter
- 10 minute ramp to 250°C + 60 minutes @ 250°C (Conventional Air Circulated Oven)
- 10 minute ramp to 250°C + 60 minutes @ 250°C (N2 Oven)
Direct Bonded Copper (DBC)
- 10 minute ramp to 200°C + 60 minutes @ 200°C (on Au)
- 10 minute ramp to 250°C + 60 minutes @ 250°C (on Ag)
Pressure Sintering Process
Air dry 40 minutes @ 120ºC then sinter 2 minutes @ ≥250 °C at >10 MPa pressure
