TG1500I | Thermal Grease
Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
- 0.03 Thermal Impedance
- 1.5 Thermal Conductivity
- 30μm BLT
Product Description
TG1500I Thermal Silicone Grease offers a thermal conductivity of 1.5 W/mK and a controlled bond line thickness of 30 micron @35psi, 50oC. Its viscosity and excellent thixotropy make it fit for large–scale production with dispensing, screen printing and stencil printing. It is an excellent, option for thermally demanding applications that can support a >30um BLT.
TG1500I is used for applications with high power density requirements. It provides superior thermal performance with ease of use across a multitude of applications. It is a stable homogeneous mixture under room temperature with an operating temperature range of -40oC to 150oC. Please note that this thermal grease contains solvent and requires a drying step.
Product Key Features:
- Low thermal resistance (0.021°C-in²/W at 50 psi) — effectively address overheating and reliability issues
- Maintains high reliability and performance across demanding environments and applications
- Suitable for use in pneumatic dispensing and screen printing systems, supporting automated and high-volume manufacturing
Applications
- Heat dissipation from heat-generating components (like CPUs and GPUs) to cooling solutions (like heat sinks).
TG1500I
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TDS, SDS & Technical Documents
- TG1500I
