TG 5500 | Thermal Grease
Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
- 0.01 Thermal Impedance
- 5.5 Thermal Conductivity
- 23μm BLT
Product Description
TG5500 Thermal Silicone Grease offers the highest thermal conductivity of our product line (5.5 W/mK) and a controlled bond line thickness of 23 micron @35psi, 50oC. Its viscosity and excellent thixotropy make it fit for large–scale production with dispensing, screen printing and stencil printing. It is an excellent, option for thermally demanding applications that can support a >20um BLT.
TG5500 is used for applications with high power density requirements. It provides superior thermal performance with ease of use across a multitude of applications. It is a stable homogeneous mixture under room temperature with an operating temperature range of -40oC to 150oC. Please note that this thermal grease contains solvent and requires a drying step.
TG5500
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- Honeywell TG5500 SDS
- TG2000I-TG5500TDS0914
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Physical Properties
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