TGP 2000E | Thermal Gap Pad
Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other

Main features
- 0.95 Thermal Impedance
- 2.0 Thermal Conductivity
- Excellent surface wetting
Product Description
Honeywell TGP2000E Thermal Gap Filler Pads provide high thermal performance with ease of use across multitude of applications. Its ultra-high compressibility enables low stress and excellent conformity to mating surfaces. It is designed to minimize thermal resistance at interfaces, and maintain excellent performance through reliability testing.
TGP2000E is naturally tacky, and requires no additional adhesive which could inhibit thermal performance. Even though these pads come in large dimensions, it is suggested to cut and apply them in smaller pieces to ensure part uniformity and to avoid any issues related to their application. Products are available in a thickness range from 0.5mm to 5.0mm.
Packaging
TDS, SDS & Technical Documents
- TGP2000E-TDS-EN(2023.5.4)
- CAPLINQ Honeywell Thermal Interface Material Gap Filler Troubleshooting Guide
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
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