TGP 6000 | Thermal Gap Pad
Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
Main features
- 0.25 Thermal Impedance
- 6.0 Thermal Conductivity
- Excellent surface wetting
Product Description
Honeywell's TGP6000 Thermal Gap Pads (TGP) exhibit exquisite thermal and electrical properties.With a Thermal conductivity of 6 W/mK and a Dielectric constant of 8.5 they are designed to minimize thermal resistance at interfaces, and maintain excellent electrical performance through extensive reliability testing. They have excellent surface wetting designed for low contact resistance.
Honeywell's TGP6000 is naturally tacky, and requires no additional adhesive which could inhibit thermal performance.
Thickness range:
- 0.5-5.0mm with 0.25mm incremental
Thickness Tolerance: >1mm, ±10%
- 0.5-1mm, ±0.1mm
- <0.5mm, ±0.05mm
TGP6000
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 16 weeksPackaging
TDS, SDS & Technical Documents
- Honeywell TGP6000 SDS
- TGP5000, TGP6000 and TGP8000_TDS
- TGP1200-TGP8000TDS191016
- AppNotePad-R1-6
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
