TGP 7500C | Thermal Gap Pad

TGP7500C Thermal Conductive Gap Pad delivers exceptional thermal performance with minimal assembly stress, making it ideal for high-power electronic applications such as power modules, automotive ECUs, telecom hardware, and high-density CPUs/GPUs. Its ultra-high compressibility ensures optimal interface contact—even with uneven or delicate surfaces—reducing air gaps and enhancing thermal transfer.

Product Key Features:

• High thermal performance (7.5W/m•K thermal conductivity & 0.16 °C•cm²/W thermal impedance) — designed to minimize thermal resistance
• Ultra-high compressibility for low stress applications
• Available in different thickness (0.5-5.0mm with 0.25mm incremental)

TGP7500C is engineered to minimize thermal resistance across the interface by leveraging its soft silicone matrix filled with high-performance ceramic particles. It maintains stable performance across thermal cycling and humidity testing, ensuring long-term reliability in mission-critical environments.

Thickness range:

• 0.5-5.0mm with 0.25mm incremental

Thickness Tolerance: >1mm, ±10%

• 0.5-1mm, ±0.1mm
• <0.5mm, ±0.05mm

Applications

• Thermal management in different electronic applications such as in power conversion equipment, semiconductor memory modules, and high performance servers.