TGP 8000 | Thermal Gap Pad
Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other

Main features
- 0.2 Thermal Impedance
- 8.0 Thermal Conductivity
- Low oil bleeding/Outgassing
Product Description
Honeywell's TGP8000 Thermal Gap Pads (TGP) provide high thermal performance with ease of use across a multitude of applications. Its ultra-high compressibility enables low stress and excellent conformity to mating surfaces. They are designed to minimize thermal resistance at interfaces, and maintain excellent performance through reliability testing. They have the lowest Thermal impedance out of the entire thermal gap pad portfolio, only to be matched by TGP8000HV that is a similar material with Higher Breakdown Voltage.
Honeywell's TGP8000 is naturally tacky, and requires no additional adhesive which could inhibit thermal performance. It exhibits low oil bleeding and outgassing along with low hardness. Naturally, the bleeding will depend on the pressure differential. A 0.5mm pad can be compressed to fill sub-0.4 mm gaps.
Products are available in a thickness range from 0.5mm to 5.0mm.
Packaging
TDS, SDS & Technical Documents
- Honeywell TGP1200 - TGP8000 TDS
- Honeywell TGP8000 SDS
- TGP5000, TGP6000 and TGP8000_TDS
- TGP8000_ASIS
- AppNotePad-R1-6
- CAPLINQ Honeywell Thermal Interface Material Gap Filler Troubleshooting Guide
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
