TGP 8000 | Thermal Gap Pad

Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other

TGP8000| Thermal Gap Pad

Main features

  • 0.2 Thermal Impedance
  • 8.0 Thermal Conductivity
  • Low oil bleeding/Outgassing

Product Description

Honeywell's TGP8000 Thermal Gap Pads (TGP) provide high thermal performance with ease of use across a multitude of applications. Its ultra-high compressibility enables low stress and excellent conformity to mating surfaces. They are designed to minimize thermal resistance at interfaces, and maintain excellent performance through reliability testing. They have the lowest Thermal impedance out of the entire thermal gap pad portfolio, only to be matched by TGP8000HV that is a similar material with Higher Breakdown Voltage.

Honeywell's TGP8000 is naturally tacky, and requires no additional adhesive which could inhibit thermal performance. It exhibits low oil bleeding and outgassing along with low hardness. Naturally, the bleeding will depend on the pressure differential. A 0.5mm pad can be compressed to fill sub-0.4 mm gaps.

Products are available in a thickness range from 0.5mm to 5.0mm.

Product Family

TGP8000

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TDS, SDS & Technical Documents
  • Honeywell TGP1200 - TGP8000 TDS
    English (Technical Data Sheet (TDS))
  • Honeywell TGP8000 SDS
    English (Safety Data Sheet (SDS))
  • TGP5000, TGP6000 and TGP8000_TDS
    English (Technical Data Sheet (TDS))
  • TGP8000_ASIS
    English (Safety Data Sheet (SDS))
  • AppNotePad-R1-6
    English (Technical documents)
  • CAPLINQ Honeywell Thermal Interface Material Gap Filler Troubleshooting Guide
    English (Technical documents)

Technical Specifications

General Properties
Color Color
Gray
Film Thickness Film Thickness
0.5 - 5 mm
Specific Gravity Specific Gravity
3.4
Thermal Properties
Thermal Conductivity Thermal Conductivity
8.0 W/m.K
Thermal Impedance Thermal Impedance
0.2 °C·cm²/W
UL 94 Rating UL 94 Rating
V-0
Electrical Properties
Volume Resistivity Volume Resistivity
6500000000000000 Ohms⋅cm

Additional Information

Thermal Resistance versus Pressure Graph at Different Thickness of TGP8000 ASTM D5470

Compression Deflection Graph at Different Thickness of TGP8000 ASTM D575

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