OPTOLINQ TMC-3282 | Transparent Mold Compound

Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other

OPTOLINQ TMC-3282 | Transparent Mold Compound

Main features

  • Exceptional moldability with long spiral flow
  • Excellent performance at high temperature and high humidity conditions
  • Excellent adhesion and low stress

Product Description

OPTOLINQ TMC-3282 is a high performance optically clear epoxy molding compound specifically designed for the encapsulation of optoelectronic packages for automotive applications such as ambient light sensors and detectors. With its high spiral flow, it ensures precise and intricate molding.

OPTOLINQ TMC-3282 offers low moisture sensitivity maintaining performance even in high temperature and humidity conditions. TMC-3282 stands out with its superior moldability and reliability, ensuring good quality and precision in optoelectronic device molding.

Key Features:

  • Low inner stress, strong adhesion and low moisture sensitivity
  • Superior process characteristics and high reliability
  • Durable Clarity

 

Product Family

TMC-3282

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Product availability
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Packaging
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TDS, SDS & Technical Documents
  • TDS_OPTOLINQ TMC-3282
    English (Technical Data Sheet (TDS))
  • MSDS_OPTOLINQ TMC-3282
    English (Safety Data Sheet (SDS))

Technical Specifications

General Properties
Color Color
Transparent
Specific Gravity Specific Gravity
1.24±3
Thermal Properties
Glass Transition Temperature (Tg) Glass Transition Temperature (Tg)
>125 °C
Physical Properties
Spiral Flow @ 175°C Spiral Flow @ 175°C
70-180 cm
Mechanical Properties
Molded Shrinkage Molded Shrinkage
1.5 %
Curing Conditions
Transfer Pressure Transfer Pressure
5.5±2.5 kg/cm2
Transfer Time Transfer Time
50±10 s

Additional Information

Processing Instructions

  • Before use, allow TMC-3282 to reach room temperature (20±5 °C, 40±15% RH) for a minimum of 24 hours, ensuring the bag remains unopened to prevent moisture contamination.

  • For TMC-3282, preheating can be performed using standard RF equipment. Preheating must be done slowly to achieve uniform temperature.

  • Apply an outer releasing agent, such as silicones or fluorinated compounds, to the mold surface to facilitate easy release from the mold dies. Different curing conditions should be used depending on the mold design package, kind, and device type.

  • Prior to molding with TMC-3282 or any new material, the mold should be cleaned thoroughly. To prepare the mold, the initial three shots should be cured for 5–10 minutes. After this initial preparation period, you can reduce the curing time to a level that provides sufficient hot hardness for effective release.

 

Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.

 

Storage and Handling

OPTOLINQ TMC-3282 is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment, ideally at –10°C or lower. The shelf life under this condition  is 6 months.

 

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