OPTOLINQ TMC-3282SF | Transparent Mold Compound
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Exceptional moldability with long spiral flow
- Excellent performance at high temperature and high humidity conditions
- Excellent adhesion and low stress
Product Description
OPTOLINQ TMC-3282SF is a high-performance optically clear epoxy molding compound specifically designed for the encapsulation of optoelectronic packages for automotive applications such as ambient light sensors and detectors. TMC-3282SF is a version with higher spiral flow, compared to the TMC-3282.
OPTOLINQ TMC-3282SF offers low moisture sensitivity maintaining performance even in high temperature and humidity conditions. TMC-3282SF stands out with its superior moldability and reliability, ensuring good quality and precision in optoelectronic device molding.
Key Features:
- Low lumen decay
- Low inner stress, strong adhesion and low moisture sensitivity
- Superior process characteristics and high reliability
- Durable Clarity
- MSL 2 Capable
Alternative to: XX-814 Series, XX1000 Series
TMC-3282SF
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TDS_OPTOLINQ TMC-3282SF
- SDS_OPTOLINQ TMC-3282SF
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Curing Conditions
Additional Information
Processing Instructions
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Before use, allow TMC-3282SF to reach room temperature (20±5 °C, 40±15% RH) for a minimum of 24 hours, ensuring the bag remains unopened to prevent moisture contamination.
- After thawing, TMC-3283SF must be used within 8-12 hours.
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For TMC-3282SF, preheating can be performed using standard RF equipment. Preheating must be done slowly to achieve uniform temperature.
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Apply an outer releasing agent, such as silicones or fluorinated compounds, to the mold surface to facilitate easy release from the mold dies. Different curing conditions should be used depending on the mold design package, kind, and device type.
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Prior to molding with TMC-3282SF or any new material, the mold should be cleaned thoroughly. To prepare the mold, the initial three shots should be cured for 5–10 minutes. After this initial preparation period, you can reduce the curing time to a level that provides sufficient hot hardness for effective release.
Please note that the provided information is based on available data and typical conditions. For specific applications and detailed test results, refer to the actual test data and conduct appropriate certifications.
Storage and Handling
OPTOLINQ TMC-3282SF is available in pressed pellets in a wide range of sizes to meet specific customer needs. To ensure product integrity, keep it away from oxidizing materials. For long-term storage, maintain a cold environment, ideally at –10°C or lower. The shelf life under this condition is 6 months.
