LOCTITE ECCOBOND UF 1175
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- White
- Low CTE
- Easy dispensability
Product Description
LOCTITE ECCOBOND UF 1175 partial, white epoxy underfill is formulated for use on large chip sizes, providing good UPH and reliability. Typically used as an electronics encapsulant and a circuit board underfill
LOCTITE ECCOBOND UF 1175 is a fast cure, monocomponent underfill with controlled flow. It offers low CTE and can be dispensed easily and without stringing.
Cure Schedule
- 15 minutes @ 120°C
UF1175
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- TDS LOCTITE ECCOBOND UF 1175 issue 12-21
- LOCTITE ECCOBOND UF 1175 NL-MSDS_UT_NL
- LOCTITE ECCOBOND UF 1175 NL-MSDS_UT_EN
- CAPLINQ Underfill Material Handling Guide
Technical Specifications
General Properties
Thermal Properties
Physical Properties
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