LINQBOND UF3801 | Underfill
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- solvent-free
- low viscosity
- Fast cure
Product Description
LINQBOND UF3801 is a one-component epoxy adhesive designed for electronic device bonding. It is easy to use and suitable for various applications, such as casting and sealing electronic components. This resin cures quickly at high temperatures, reducing working time and increasing efficiency.
LINQBOND UF3801 forms tough, strong structural bonds that offer excellent shear, peel, and impact strength. The durability of this resin is exceptionally high, and it can successfully pass numerous environmental tests.
UF3801
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 16 weeks
Shipping in 16 weeks
Shipping in 16 weeksPackaging
TDS, SDS & Technical Documents
- TDS_LINQBOND UF-3801
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
Rework Process:
-
Component Removal. Component solder joints must be heated above their reflow temperature (260°C to 280°C). At this temperature, the undefill will be soft and easy to remove. Component may then be pulled or removed by twisting or with a use of a vacuum pick-up nozzle.
-
Site Preparation. After component removal, cleaning of residues may be done by the following methods
- Scraping. Heat the site to 250°C to 300°C and scrape off the underfill carefully avoiding damage of pads on the substrate. Alternatively, heating can also be done from the bottom of the substrate.
-
Rotating Brush. Apply sufficient amount of pressure onto the brush to clean the residues. Care should be taken to avoid damage to substrate.
- Component Replacement. Isopropanol or a flux pen may be used to ensure no residue remain on the circuit board after cleaning. Brush solder paste or flux on the board and align the new component using vacuum and reflow using hot air. Underfill will likewise be applied followed by cure step.
Storage and Handling
Store and transport below -5°C temperature. Keep away from moisture and heat sources. It is strictly forbidden to store in outdoor environments.
