LOCTITE ECCOBOND UF 3812
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Halogen free
- Room temperature flow
- One component
Product Description
LOCTITE ECCOBOND UF 3812 reworkable epoxy underfill is designed for CSP, WLCSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.
LOCTITE ECCOBOND UF 3812 exhibits stable electrical performance under thermal/humidity bias is compatible with most Pb-free solder and has excellent thermal cycling performance.
Cure Schedule
- >10 minutes @ 130°C
UF3812
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- LOCTITE ECCOBOND UF 3812
- CAPLINQ Underfill Material Handling Guide
- LOCTITE ECCOBOND UF 3812 55ML NL-MSDS_UT_NL
- LOCTITE ECCOBOND UF 3812 55ML NL-MSDS_UT_EN
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Additional Information
What are the benefits of a reworkable underfill?
Working with a reworkable underfill post cure will demonstrate the following:
- The substrate has low residue after package de- bonding
- The underfill has low adhesion to the solder mask making mechanical scraping easy
- After cleaning, board surface is almost residue free
When we are using a non reworkable underfill on the other hand:
- Board surface shows >50% residue after package de-bonding. De-bonding also damages the substrate
- After cleaning, the board surface residue is 40% with 10% solder mask damage
It goes without saying that a reworkable underfill is highly preferred for applications that might require reworking at any point of their lifespan (for example repairing expensive motherboards or fine tuning already assembled parts)
