LOCTITE ECCOBOND UF8830S

LOCTITE® ECCOBOND UF 8830S liquid epoxy Capillary underfill is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow. When fully cured, this material forms a rigid, low stress seal that dissipates stress in solder joints and extends thermal cycling performance.

LOCTITE® ECCOBOND UF 8830S achieves MSL L3/L2A and passes all reliability requirements, including automotive applications, without fillet cracks after 4000 cycles(TC -55/150°C). It demonstrates excellent wettability to different substrates, has a wide process window and is also compatible with pressure ovens. Its High Tg with its minimal shift ensures a stable performance for applications with high operating temperatures.

Cure Schedule

• 30 minute ramp from 25°C to 150°C, hold 2hrs at 150°C