WMC-G261 | White Epoxy Molding Compound for Optocouplers
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- Excellent reflectance
- Ideal spiral flow
- Superior moldability and reliability
Product Description
OPTOLINQ WMC-G261 is a specialized coupler epoxy molding compound that provides superior protection and performance for optoelectronic devices. WMC-G261's unique formulation ensures excellent encapsulation, protecting sensitive components from environmental stresses, improving device reliability.
Product Key Features
- Optimized Spiral Flow — Perfectly suited for typical molding conditions, ensuring complete and uniform encapsulation without voids.
- High Heat Resistance & Reflectance — Crucial for optoelectronic applications, maximizing light output and efficiency.
- Superior Moldability & Reliability — Allows for precise and consistent shaping around delicate components, which in turn leads to enhanced long-term reliability of the encapsulated device.
Applications
- Encapsulation of various optoelectronic devices, including LED lead frames and fiber optic components.
- Ideal for protecting and coupling passive optical components.
- Suitable for encapsulating optical sensors and detectors.
OPTOLINQ WMC-G261 is recommended for use in conjuction with CHEMLINQ semiconductor mold maintenance products to ensure proper release from mold dies.
WMC-G261
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Technical Specifications
General Properties
Thermal Properties
Mechanical Properties
Physical Properties
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