LOCTITE ABLESTIK 2200D
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Low stress
- Snap curable
- Low moisture absorption
Product Description
LOCTITE ABLESTIK 2200D electrically conductive die attach adhesive is designed for high reliability leadframe packaging applications. This hybrid, low stress product can be snap cured and shows excellent how/wet adhesion on metal leadframes.
LOCTITE ABLESTIK 2200D offers low moisture absorption and low modulus that contribute to its improved JEDEC performance.
Cure Schedule
- Fast Cure Oven: 15 to 30 minutes @ 175°C
- Hot Plate Spot Cure: 30 seconds @ 200°C
2200D
Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
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TDS, SDS & Technical Documents
- ABLESTIK 2200D-EN
- 1204802_MSDS_UT_US_EN
- LOCTITE ABLESTIK 2200D known as Ablebond 2200D (15
Technical Specifications
General Properties
Electrical Properties
Physical Properties
Thermal Properties
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