LOCTITE ABLESTIK 2332
Harmonization Code : 3907.30.00.85 | Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
- One component
- Excellent adhesion
- High strength
Product Description
LOCTITE® ABLESTIK 2332 is a solventless epoxy adhesive that develops high bond strength when cured at temperatures as low as 100°C. This product combines toughness at low temperatures plus high peel and tensile shear strengths over a very broad temperature range
LOCTITE® ABLESTIK 2332 is a black, heat curing non conductive adhesive, ideal for Copper, Aluminum, Nickel, FRP surfaces and Rigid plastics. It is a universal adhesive that can be used, among others, for SMD components, caps and lids.
Cure Schedule
- 1 hour @ 120°C
- 90 minutes @ 100°C or
- 30 minutes @ 120°C or
- 20 minutes @ 150°C
2332
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TDS, SDS & Technical Documents
- LOCTITE ABLESTIK 2332
- LOCTITE ABLESTIK 2332 SDS
