LOCTITE ECCOBOND 3185
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Thermally conductive
- Electrically conductive
- Low modulus
Product Description
Henkel is discontinuing production of LOCTITE ECCOBOND 3185 as of June 1 2023. The last date to place orders for this product is March 31, 2023. We ask that you consider LOCTITE ABLESTIK CE3920 as a potential replacement,
LOCTITE ECCOBOND 3185 heat curable silicone adhesive is designed for thermally enhanced flip chip BGA applications. This material is sensitive to amines, phospines, acids and sulfur containing materials.
LOCTITE ECCOBOND 3185 needs to be isolated from uncured epoxy-based resins as interaction will inhibit curing. Interaction will inhibit curing. It is typically used for bonding ICs to integrated heat spreaders in laminate BGA applications.
Cure Schedule:
- 60 minutes @ 175°C
- 60 minutes @ 100°C + 60 minutes @ 175°C
Packaging
TDS, SDS & Technical Documents
- 1202213_MSDS_UT_US_EN
- ECCOBOND 3185-EN
- 11-4-2022 Notification - Discontinuation 3185
