LOCTITE 3220
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Heat Cure
- Lowest cure temperature
- Image sensor module sealing
Product Description
LOCTITE 3220 heat cure adhesive is designed for use in the sealing of heat sensitive electronic components. It is a multi purpose, single component epoxy with excellent adhesion that requires no mixing and cures fast at low temperatures.
LOCTITE 3220 is typically used as an adhesive or sealant for image sensors and MMC, MultiMediaCard devices. It is one of the adhesives with the lowest cure temperature (bar RTVs) and exhibits high adhesion on FR4, glass and many engineering plastics
Heat Cure
- 5-10 minutes @ 80°C
- 1hour @ 60°C
3220
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Shipping in 50 days
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TDS, SDS & Technical Documents
- 3220-EN
- 922576_MSDS_UT_US_EN
- LOCTITE 3220 known as Loc3220 (-20CD),
Technical Specifications
General Properties
Thermal Properties
Chemical Properties
Physical Properties
Additional Information
